Technology - Opto: High Power Laser Diodes

  • Process Highlights
    • Placement accuracies from +/- 1µm to +/-20µm
    • Fully automated or manual placement
    • Adjustable bond force
    • 3-axis placement control
    • Void free Eutectic die attach
    • Control of flatness "smile"
    • Epi-side down or up assembly
    • Vacuum reflow processes
  • Materials
    • GaAs or InP
    • Size
      • Laser bars in excess of 10mm
      • Laser single emitters to 5mm
    • Package Type
      • C-mount (standard sizes of 4mm to 5mm, sharp edge for accurate placement)
      • CS-mount
      • TO-can
      • Stacks
    • AuSn/Indium solder processes (preforms, pre-deposited substrates to control solder overspill
    • CuW/Cu/AlN/CuW sub-mounts and heat-sinks