Technology - Microelectronics: System-in-Package

  • Wire-Bonding
    • Low loop heights (less than75µm with 20µm wire diameter)
    • Reverse bonding (loop heights <50um)
    • Small diameter wire (17u min)
    • Longer wire bond lengths (~6mm with 25µm wire diameter)
    • Overhang bonds
    • Die to Die bonding
    • Straighter wires (less wire sway)
    • Variety of wire bond thicknesses to control wire sway.
    • Stand-off stitch (wire to bump)
    • Die over hang and bonding to unsupported die edges
  • Wafer/Die handling
    • Dicing of thin wafers (>100µm)
    • Die handling to 250 µm on a side
    • Handling of thin die (e.g 50u thick , 15mm x 15mm on a side) and control of warpage
  • Stacked Die
    • Accurate placement of die and control of epoxy bleedout
    • Downloads methods for keeping die in place for accurate 2nd die attach
    • Controlled bond line thickness to reduce height
    • Control of post reflow ball height
  • Multi-chip Modules
    • Multiple component assembly on single substrate
    • Placement and attach of passive components (Saw filters, EMI shields, connectors, 0201 components etc)
    • Placement and attach of MEMs, Opto and Mechanical components with active microelectronic components
    • Double-sided board assemblies
  • Other
    • Various die technologies (Si, GaAs, SiGe, SOI, MEMs, InP, GaN)
    • BGA attach
    • Flip chip
    • Ball bumping