Technology - Microelectronics: RF/MMIC modules

  • Process Highlights
    • Controlled wire-bonding on automated equipment for optimal wire bond loop profile
    • Wire bond length control less than 75um
    • Gold ball
    • Wedge-Wedge
    • Ribbon bonding (25umx50um, 25umx75um)
    • Non-contact handling process for MMIC die
    • Accurate placement of die to transmission lines
  • Materials
    • Substrates: Duroid, FR4, Ceramics
    • Conductive or Eutectic Die attach
  • Products: RF transmitter/receiver modules/Optical RF Modules