Technology - Microelectronics: Flip-chip

Process Highlights

  • Chip placement accuracy down to 10µm
  • Die pad pitch to 50µm for gold bumps
  • Max number of bumps 1000
  • Gold ball bump height and size
    • 20u-80u height, diameter 40-100u
    • Wide variety of bump shapes (low profile, pointed bump, double/triple bump)
      • Pointed bump for epoxy dipping
      • Low profile helps thermosonic compression force to form good intermetallic bond
    • Planarity of +/- 2um
    • No need for separate coining process due to unique shear process across top of bump during bump process
  • Package/substrate sizes to 100mm
  • Underfill for CTE match and reliability
  • Thermosonic, Thermocompression, Ultrasonic, reflow or non-conductive epoxy attach, conductive epoxy on tips of bumps
  • Control of placement/alignment of bumps to pads during cure or reflow
  • X-ray evaluation for connectivity evaluation

Typical Materials (other options available on request)

  • Substrate: BT Laminate, Ceramic, FR4, silicon
  • Packages: Customer specified
  • Underfill: Hysol FP4530, FP4511 etc.
  • Bump material; Au stud bumps, Eutectic, High Pb, Pb free
  • Die: Si, GaAs, GaN, SiGe, MEMs, InP, GaN