Technology - Microelectronics: Fast-turn IC assembly

Offering

• Wafer Saw
• Ceramic packages
  • CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header
• Open-cavity packages - virtually all production plastic packages
  • QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA
• FR4, Rodgers
• Plastic equivalent Packages
• Over molded plastic package capability
• Eutectic and Epoxy die attach
• Pad size and pitch down to 50µm
• Tape on Lid, Epoxy sealed or Solder sealed lid
• Glop top/remolding (flattening)
• Hermetic sealing
• Lead-cropping

Benefits

• Fast-turn around - same day delivery possible
• Flexibility to handle last minute changes and accommodate non-standard die/wire bond layouts.
• No minimum order quantities
• Open Cavity Plastic Package benefits;
  • Duplicates production package performance
  • Remolding option
  • Eliminates special socket requirements
  • Accurate performance evaluation/validation of simulations and electrical parameters