Technology - Microelectronics: CMOS Camera modules

  • Process Highlights:
    • Assembly using controlled clean environments
    • Die/Lens placement accuracy down to +/-10µm
    • Automated die/lens placement accuracy +/-15µm
    • Die rotation Control (2 deg to 5 deg)
    • Die tilt control (dependant on package flatness)
    • Automated assembly process
    • Lens barrel assembly
    • Auto-focus actuator assembly
    • Filter attach
    • Optimised wafer saw process to reduce particle contamination. Wafer saw for IR glass and filters
  • Standard Materials:
    • Substrate: BT Laminate, Ceramic, FR4
    • IR Glass: Boro-Silicate glass with/without IR coating
    • Mount: Design Specific
    • Lens: Design Specific
    • Barrel: Design Specific
    • Gold wire: 20µm-33µm
    • Solder: Design Specific
    • Die attach: Ablestik conductive. Various other options available on request
    • IR Glass attach: Ablestik Non-conductive. Various other options available on request