microfocus xray
Inspection tool for failure analysis or quality control
5kg sample weight; 50cm height limit
Real-time; 0-450 any view, 360° around position; 4um resolution
Optocap’s Microfocus Xray capability is used for a wide variety of failure analysis applications including;
- Die Attach/Area void percentage calculation
- BGA Analysis including diameters, void percentages, area, roundness
- Assessment of open and shorts
- Wire bond analysis
- Component distance measurements