Understanding the required environmental operating conditions, thermal, optical, mechanical and electrical requirements are the key to any successful package design activity.

Optocap utilize Design for manufacturing techniques to ensure that any designs are compatible with a low cost, high yield assembly process.

Thermo-mechanical finite element modelling will be used at the front end of the package design to assess the mechanical design positional stability and the component temperature gradients over package temperature exposures and device thermal loading. This activity will drive the definition and design of the package, layout of components, material selections and thickness for resistance to thermal gradient warpage, heat-sinking and cooling options, and appropriate joining materials to ensure expansion matching of materials. Optical modeling software will be used to define aspects of the module performance and its sensitivity to the positional placement of the components.

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