wire bonding services
Wire bonding is the main method of making interconnections between a semiconductor die and a package or substrate.
Optocap works closely with our customers at the package design stage to ensure that design for manufacturing techniques are applied and wire bond design rules, where possible, are adhered to. This co-design activity is crucial in the development a high yield, fully automated and fully optimized wire bond process.
By controlling and optimizing key wire bond process and material parameters such as ultrasonic energies and wire specification a robust and reliable wire bond processes can be developed.
Optocap also offers wire pull and ball shear test data to enable qualification of the wire bond process.
Optocap’s expertise and capability in wire bonding will reduce risk and reduce time to market for your wire bonding requirements as well as providing a cost-effective manufacturing option.