SITEMAP | DISCLAIMER | DATA PROTECTION
  • HOME
  • ABOUT US
  • SERVICES & CAPABILITIES
  • APPLICATIONS
  • NEWS
  • CONTACT US
  • BLOG
Management Partners Value Proposition Recruitment Events
Assembly Process Design Failure Analysis Environmental Testing Key Equipment
Laser Diode Packaging RF Module Packaging Optoelectronic Photonic Packaging System in Package Flip Chip Assembly Microelectronic Packaging MEMS Packaging LED Packaging CPV Concentrator Photovoltaic Packaging Chip on Board Assembly Harsh Environment Packaging
Latest News & Events
Get in touch
You are here: Home > Services and Capabilities > assembly process > wire bonding services > ribbon bonding

ribbon bonding

Assembly Process

  • Wafer Sawing
  • Wire Bonding Services
    • Gold Wire-Bonding
    • Wedge Bonding
    • Ribbon Bonding
  • Die Bonding
    • Solder Die Bonding
    • Epoxy Die Attach
    • Flip Chip Bonding
  • Pick and Place
  • Stud Bumping
  • Fiber Alignment
  • Encapsulation and Hermetic Sealing

Design

  • Optical Design
  • Package Design and Modelling

Failure Analysis

  • Microfocus Xray

Environmental Testing

Key Equipment

Ribbon Bonding Au 25µm(1.0mil) X 250µm(9.8mil) ribbon. Consult factory for additional sizes.

The larger surface area of the ribbon makes it an ideal interconnection option for high speed RF applications.

Follow us

CORE BUSINESS

  • Contract Package Design and Semiconductor Assembly
  • Opto and Microelectronic Assembly
  • Pure-Play-IP Protection
  • Solutions spanning the full product life-cycle
  • Reduce Costs, Time to Market and Risks

ABOUT US

  • Management
  • Partners
  • Value Proposition
  • Recruitment
  • Events

SERVICES & CAPABILITIES

  • Assembly Process
  • Design
  • Failure Analysis
  • Environmental Testing
  • Key Equipment

APPLICATIONS

  • Laser Diode Packaging
  • RF Module Packaging
  • Optoelectronic Photonic Packaging
  • System in Package
  • Flip Chip Assembly
  • Microelectronic Packaging
  • MEMS Packaging
  • LED Packaging
  • CPV Concentrator Photovoltaic Packaging
  • Chip on Board Assembly
  • Harsh Environment Packaging

CONTACT US

5 Bain Square
Livingston
Scotland, UK
EH54 7DQ

E: info@optocap.com
T: +44(0)1506 403 550
F: +44(0)1506 403 551

Website by Stone.
SITEMAP | DISCLAIMER | DATA PROTECTION // © 2011 Optocap Ltd