Optocap offers Gold (Au) ball wire bonding utilizing advanced automated wire bonding equipment.

Wire bond diameters from 17um to 33um can be handled with a capability for fine pitch wire bonding down to 50um.

Optocap also utilizes a range of advanced wire bonding techniques including reverse bonding for low loop profiles, die to die bonding and deep access wire bonding in a package to different heights.

Optocap’s Gold (Au) ball wire bonding services are applied to wide range of package types including ceramic packages, open-cavity plastic packages and PCB’s.