fiber alignment

Optocap has extensive experience in aligning and attaching fibers and optical components to wide range of optoelectronic devices including DFB lasers, Quantum Cascade lasers, SLEDs, SOA’s and Receivers.

Optocap offers a standard Telcordia compliant platform for packaging and fiber coupling optoelectronic devices into 14-pin Butterfly package. This standard platform incorporates a Thermistor, Thermoelectric Cooler (TEC) and back-facet photodiode monitor. A fully flux and organic free process is used to avoid any contamination that may compromise the delicate optical surfaces.  A fully hermetic seal casing in an inert gas atmospheres offers increased lifetime of the optoelectronic device. A laser welded fiber attach process is used to provide a robust and reliable attachment. This standard platform has undergone extensive environmental testing to demanding Telcordia standards.

Optocap’s standard platform provides several key benefits;

  • Avoids Design and Development NRE charges.
  • Utilises Telcordia/Space compliant processes and materials.
  • Enables faster time to market by utilising off-the-shelf components and avoiding key technical pitfalls.
  • Provides competitive unit prices based on automated assembly processes and utilising economies of scales for purchasing materials.

Optocap’s standard platform has the following features;

  • Wide range of packages including 14-pin butterfly packages and TO-cans.
  • PM, SM, MM, Polycrystalline, High temperature fibres and FVA’s including lensed options.
  • Laser weld or epoxy attach of fiber assembly
  • High quality AR coating with variety of lens designs to maximise coupling efficiency
  • Solutions for a wide range of devices and wavelengths including DFB, DBR lasers, SOA’s, SLD’s VCSEL’s, Photodiodes and Quantum Cascade lasers
  • Isolators and Free-Space optics
  • Thermistor, TEC and Monitor Photodiode