Optocap has experience with a wide range of solder materials including soft and hard solders, Pb-free solders, Eutectic solders and solders for operation over a wide temperature range.

This knowledge is critical in supporting our customers in making the correct decisions on solder material selection for their product.

For many Opto, MEMS or Sensor devices fluxes can pose reliability concerns with contamination of the sensitive active regions of these devices. As a result many of the solder attach processes at Optocap are based on a flux free solder process utilizing solder preforms or pre-tinned substrates with a subsequent Vacuum Reflow processes, or reflow using Pulsed Heat-Stages with reducing or cover gas to prevent oxidation.

In order to use a solder attach process the components require a compatible metal surface. Optocap can provide input on appropriate surface finishes.

Solder pastes are screen printed onto substrates in patterns defined by custom designed stencils. Components are then pick and placed into the solder paste and reflowed using conventional IR reflow processes.

For many applications, including laser diode or HB-LED die attach, a good void-free interface is required. Control of process parameters, such as the downward force and reflow profiles, is crucial in achieving a void-free joint. Where appropriate Optocap uses its Micro-Focus x-ray capability to asses the voiding level in the solder joint and die shear capability to asses the mechanical strength of the joint. All die attach processes are inspected and tested to MIL-STD, or greater if required by the customer.

Optocap’s expertise and capability in die bonding will reduce risk and reduce time to market for your die bonding requirements as well as providing a cost-effective manufacturing option.