Optocap has extensive knowledge on the rheology, thermal, electrical and cure properties of a wide range of epoxy materials.

This knowledge is critical in supporting our customers in making the correct decisions on epoxy selection for their product.

The manufacture of many microelectronic and optoelectronic devices requires the precise control of the epoxy process. Bond lines must be of specific shape and thickness to ensure good thermal properties. Epoxy squeeze out must be controlled to prevent shorting or bridging. Full epoxy coverage with no voiding is important for thermal performance and to minimize stresses. Optocap utilizes automated fluid dispensers and automated die bonders to develop a high yield and automated process whilst meeting the stringent assembly requirements outlined above.

When small components need to be attached or when many components need to be attached in close proximity to each other then very small dots of epoxy need to be used to avoid shorting. Optocap utilizes epoxy stamping or daubing techniques, whereby a pin transfers a precisely controlled amount of epoxy from an epoxy reservoir onto a package or substrate to provide epoxy spot sizes on the order of 100 microns.

For dispensing lines of epoxy or lines for an area fill then epoxy from a syringe is dispensed using a pump. Time/Pressure or Positive Displacement pumps can be used to provide a consistent epoxy volume and pattern.

The option also exists to Screen Print epoxy but this is infrequently used in Microelectronics Assembly. Optocap also has experience in the epoxy attach processes using epoxy films.

Optocap works closely with our customers to select the optimal materials and process for their application. Optocap’s expertise and capability in die bonding will reduce risk and reduce time to market for your die bonding requirements as well as providing a cost-effective manufacturing option.