assembly process
Optocap offers a full range of contract precision assembly processes for semiconductor devices. Optocap's assembly process know-how enables reduced costs and reduced time to market for our customers.
Click below to find out more information on Optocap's precision assembly services:
Wafer Sawing
Wire Bonding Services
Die Bonding
Pick and Place
Stud Bumping
Fiber Alignment
Encapsulation and Hermetic sealing