Services & Capabilities - Capabilities: Assembly

  • Water Saw:
    • Multi-Project/bumped wafers
    • Wafer grooving
    • Up to 12" wafers (after scribe and break)
    • Wafer thickness from 100µm to 1000µm
    • Various blade materials and diameters
    • Controlled chip outs and wafer saw particulates
  • Pick and place:
    • Automated and manual
    • Placement accuracy to +/-3µm
    • Die sort
    • Pattern recognition
    • Pick from Blue tape, waffle pack, Gel-Pak and Vac. release trays
  • Nanometric Epoxy dispense and daub
  • Die attach:
    • Conductive/Non-Conductive Epoxy
    • Eutecticic solder
    • Preformed solder, pre-deposited solder and solder paste
    • Die shear from mg to 100kg
  • Flip chip:
    • Device bumping/placement
    • Thermosonic, Thermocompression and Reflow die attach
    • Flip chip placement accuracy to 10µm
    • Standard underfill materials
  • Wire bond:
    • Aluminium wedge and gold ball
    • 50µm pitch capability
    • 17µm to 75µm wire diameter
    • Deep access
    • Automatic and manual process
    • Ribbon bonding
    • Wire pull and ball shear from mg to 5kg
    • Bonding to Low k materials
  • Wafer and Die gold stud bumping:
    • Up to 6" inch substrates
    • 20 µm - 80 µm height
    • 40 µm - 100 µm diameter
    • Planarity +/- 2 µm
  • Encapsulation:
    • Glob top
    • Optically clear encapsulants
    • Flattening process after glob top for "remoulded package".
    • Transfer mould
  • Vacuum solder capability:
    • Lead and flux free solders
  • Hermetic seal: Resistance weld:
    • Inert gas atmosphere
    • Dry baking chamber
  • Find and gross leak:
    • Testing to MIL-STD-883
  • Fibre align: Semi-auto fibre align:
    • Laser Weld/UV cure epoxy fiber attach
    • Free space optical assemblies
    • Passive and Active alignment
    • Fiber array alignment
    • Lensed fiber
  • Surface mount: Screen print, IR reflow
  • BGA: Ball placement and device attach