CORE BUSINESS

• Contract Package Design and Semiconductor Assembly
• Opto and Microelectronic Assembly
• Pure-Play-IP Protection
• Solutions spanning the full product life-cycle
• Reduce Costs, Time to Market and Risks

ABOUT US

• Management
• Partners
• Value Proposition
• Recruitment
• Events

SERVICES & CAPABILITIES

• Assembly Process
• Design
• Failure Analysis
• Environmental Testing
• Key Equipment

APPLICATIONS

• Laser Diode Packaging
• RF Module Packaging
• Optoelectronic Photonic Packaging
• System in Package
• Flip Chip Assembly
• Microelectronic Packaging
• MEMS Packaging
• LED Packaging
• CPV Concentrator Photovoltaic Packaging
• Chip on Board Assembly
• Harsh Environment Packaging

CONTACT US

5 Bain Square
Livingston
Scotland, UK
EH54 7DQ

E: info@optocap.com
T: +44(0)1506 403 550
F: +44(0)1506 403 551