optoelectronic photonic packaging
A key function of an optoelectronic device is to manipulate light. As a result the packaging and assembly processes for many optoelectronic components can be significantly more complex than traditional microelectronic devices.
Optoelectronic or Photonics packaging requires extremely accurate placement of components to ensure appropriate suitable alignment and coupling of light into and out of devices. In many cases the generation or detection of light results in significant heat being generated, which if not suitably dissipated through appropriate joining technology and material selection, can adversely affect the device operation. Additionally, assembly processes can be complicated by the requirement that fluxes and other organic materials can’t be used as they can degrade the performance of facets in optical devices.
Optocap has experience in the assembly and packaging of a wide range of Optoelectronic devices including;
- High power laser diodes
- PV Cells
- Optical Interconnects
- DFB’s, SOA’s
- Mach-Zender Interferometers
- Modulators
- Photodetectors
- TOSA/ROSA’s
Optocap’s expertise and capability in Optoelectronic Photonic Packaging will reduce risk and reduce time to market for your Optoelectronic packaging requirements as well as providing a cost-effective manufacturing option.
