microelectronic packaging

Optocap has detailed experience in assembly of a wide range of Microelectronic devices including the following;

  • CMOS Sensors
  • CMOS Camera Modules
  • MEM’s
    • Capacitive, Optical, Isolation structures, pressure sensor MEM’s
  • Sensors
    • Optical sensors/strain gauges
  • OLED Display
  • HB-LED Light Engines
  • RF Modules
  • LCD displays
  • Optocap also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including;
    • CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header
    • QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA

. This fast-turn assembly service offers customers a number of significant advantages;

  • Fast-turn around - same day delivery possible
  • Flexibility to handle last minute changes and accommodate non-standard die/wire bond layouts.
  • No minimum order quantities
  • Open Cavity Plastic Package benefits;
    • Duplicates production package performance
    • Remolding option
    • Eliminates special socket requirements
    • Accurate performance evaluation/validation of simulations and electrical parameters