• Laser Diode Packaging
• RF Module Packaging
• Optoelectronic Photonic Packaging
• System in Package
• Flip Chip Assembly
• Microelectronic Packaging
• MEMS Packaging
• LED Packaging
• CPV Concentrator Photovoltaic
     Packaging
• Chip on Board Assembly
• Harsh Environment Packaging

Optocap has extensive experience in the packaging high brightness LEDS (HB-LEDS).

Optocap offers customers support in both prototype/process development for LED packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing with a fully optimised and high yield process.

A case-study for a LED packaging application can be found below;

• Multiple LED attached to a single substrate and individually interconnected.
• LED die presented on Wafer Film Frame. Die ejected from film frame use precisely controlled die ejector needle to avoid damage to LED die.
• Epoxy stamped (daubed) onto substrate with diameter of 200um to provide required die attach coverage and thermal dissipation.
• LED die pick and placed onto substrate in a fully automated process.
• 25um Au wire bonding to individually wire bond each LED die.
• Frame attached round substrate and encapsulated with Silicone to provide suitable surface quality for transmission of LED light.
• Optics attached to surface to provide shaping of light.
• Populated module attached to heat-sink with solder attach process.

Optocap’s expertise and capability in LED Packaging will reduce risk and reduce time to market for your LED packaging requirements as well as providing a cost-effective manufacturing option.

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