MEMS Packaging
Optocap has experience in the assembly and packaging of MEMS devices.
Optocap offers customers support in both prototype/process development for LED packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing with a fully optimised and high yield process.
There are a number of specific technical challenges related to MEMS assembly such as special handling techniques and the restriction that many standard fluxes, adhesives and solvents can’t be used. As a result Optocap has developed an extensive “tool-kit” of material and process knowledge in all key steps of the assembly process including wafer saw, die attach, flip chip attach, wire bonding, and encapsulation. This Tool-Kit of process and material knowledge is used to reduce development times, reduce risk and reduce development and manufacturing risks for customers. Advanced packaging techniques such System-in-Package (SiP) and Wafer Scale Packaging (WSP) have also been developed to support the increasing trends in miniaturization and lower costs.
Optocap recently supported a start-up company developing a MOEMS device to reduce its time to market from an expected 12 months to 6 months. This MOEMS customer had some specific requirements. Firstly, they required a bumped die and flip chip attach process due to the high speed and low form factor demands. However, this was complicated further by the constraint that no flux could be used and traditional solder bumps could not be obtained at the fine pitch required. Optocap developed an Au stud bump process for the Die and Au-Au Thermo compression attach process for the die to substrate. This process utilised existing volume equipment and provided a high yield, low cost process.
